Universal magnetic recording head chip

ABSTRACT

An apparatus according to one embodiment includes a magnetic head having, on one module thereof, an array of N first data transducers positioned towards a media facing surface of the module, and M second data transducers interleaved with the array of first transducers. Only some of the data transducers are coupled to pads. An apparatus according to another embodiment includes a magnetic head having, on one module thereof, an array of data transducers positioned towards a media facing surface of the module, the data transducers including at least one of data readers, data writers, and combinations thereof. A plurality of pads are on the module, but less than all of the first and/or second data transducers are coupled to pads.

RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.13/677,240 filed Nov. 14, 2012, which is herein incorporated byreference.

BACKGROUND

The present invention relates to data storage systems, and moreparticularly, this invention relates to managing tape head modulesselectively tailored for use in potentially incompatible products.

In magnetic storage systems, data is read from and written onto magneticrecording media utilizing magnetic transducers commonly. Data is writtenon the magnetic recording media by moving a magnetic recordingtransducer to a position over the media where the data is to be stored.The magnetic recording transducer then generates a magnetic field, whichencodes the data into the magnetic media. Data is read from the media bysimilarly positioning the magnetic read transducer and then sensing themagnetic field of the magnetic media. Read and write operations may beindependently synchronized with the movement of the media to ensure thatthe data can be read from and written to the desired location on themedia.

An important and continuing goal in the data storage industry is that ofincreasing the density of data stored on a medium. For tape storagesystems, that goal has led to increasing the track and linear bitdensity on recording tape, and decreasing the thickness of the magnetictape medium. However, the development of small footprint, higherperformance tape drive systems has created various problems in thedesign of a tape head assembly for use in such systems.

In a tape drive system, magnetic tape is moved over the surface of thetape head at high speed. Usually the tape head is designed to minimizethe spacing between the head and the tape. The spacing between themagnetic head and the magnetic tape is crucial so that the recordinggaps of the transducers, which are the source of the magnetic recordingflux, are in near contact with the tape to effect writing sharptransitions, and so that the read element is in near contact with thetape to provide effective coupling of the magnetic field from the tapeto the read element.

BRIEF SUMMARY

An apparatus according to one embodiment includes a magnetic headhaving, on one module thereof, an array of N first data transducerspositioned towards a media facing surface of the module, and M seconddata transducers interleaved with the array of first transducers. Onlysome of the data transducers are coupled to pads.

An apparatus according to another embodiment includes a magnetic headhaving, on one module thereof, an array of data transducers positionedtowards a media facing surface of the module, the data transducersincluding at least one of data readers, data writers, and combinationsthereof. A plurality of pads are on the module, but less than all of thefirst and/or second data transducers are coupled to pads.

Any of these embodiments may be implemented in a magnetic data storagesystem such as a tape drive system, which may include a magnetic head, adrive mechanism for passing a magnetic medium (e.g., recording tape)over the magnetic head, and a controller electrically coupled to themagnetic head.

Other aspects and embodiments of the present invention will becomeapparent from the following detailed description, which, when taken inconjunction with the drawings, illustrate by way of example theprinciples of the invention.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is a schematic diagram of a simplified tape drive systemaccording to one embodiment.

FIG. 2 illustrates a side view of a flat-lapped, bi-directional,two-module magnetic tape head according to one embodiment.

FIG. 2A is a tape bearing surface view taken from Line 2A of FIG. 2.

FIG. 2B is a detailed view taken from Circle 2B of FIG. 2A.

FIG. 2C is a detailed view of a partial tape bearing surface of a pairof modules.

FIG. 3 is a partial tape bearing surface view of a magnetic head havinga write-read-write configuration.

FIG. 4 is a partial tape bearing surface view of a magnetic head havinga read-write-read configuration.

FIG. 5 is a side view of a magnetic tape head with three modulesaccording to one embodiment where the modules all generally lie alongabout parallel planes.

FIG. 6 is a side view of a magnetic tape head with three modules in atangent (angled) configuration.

FIG. 7 is a side view of a magnetic tape head with three modules in anoverwrap configuration.

FIG. 8 is a partial tape bearing surface view of a module according toone embodiment.

FIG. 9 is a partial cross-sectional view of a module according to oneembodiment.

FIG. 10A-10F are representative illustrations of different orientationsof pads according to several embodiment.

FIGS. 11A-11C are representative diagrams of leads connectingtransducers and pads according to several embodiment.

DETAILED DESCRIPTION

The following description is made for the purpose of illustrating thegeneral principles of the present invention and is not meant to limitthe inventive concepts claimed herein. Further, particular featuresdescribed herein can be used in combination with other describedfeatures in each of the various possible combinations and permutations.

Unless otherwise specifically defined herein, all terms are to be giventheir broadest possible interpretation including meanings implied fromthe specification as well as meanings understood by those skilled in theart and/or as defined in dictionaries, treatises, etc.

It must also be noted that, as used in the specification and theappended claims, the singular forms “a,” “an” and “the” include pluralreferents unless otherwise specified.

The following description discloses several preferred embodiments ofmagnetic storage systems, as well as operation and/or component partsthereof.

In one general embodiment, a module includes an array of N piggyback ormerged first data transducers positioned towards a media facing surfaceof the module; and M second data transducers interleaved with the arrayof piggyback or merged data transducers, wherein the second datatransducers are single data transducers, at least some of the datatransducers being coupled to pads.

In another general embodiment, a module includes an array of N firstdata transducers positioned towards a media facing surface of themodule, the first data transducers including at least one of datareaders, data writers, and combinations thereof; and M second datatransducers interleaved with the array of first data transducers, thesecond data transducers including at least one of data readers, datawriters, and combinations thereof, wherein less than all of the firstand/or second data transducers are coupled to pads.

FIG. 1 illustrates a simplified tape drive 100 of a tape-based datastorage system, which may be employed in the context of the presentinvention. While one specific implementation of a tape drive is shown inFIG. 1, it should be noted that the embodiments described herein may beimplemented in the context of any type of tape drive system.

As shown, a tape supply cartridge 120 and a take-up reel 121 areprovided to support a tape 122. One or more of the reels may form partof a removable cartridge and are not necessarily part of the system 100.The tape drive, such as that illustrated in FIG. 1, may further includedrive motor(s) to drive the tape supply cartridge 120 and the take-upreel 121 to move the tape 122 over a tape head 126 of any type. Suchhead may include an array of readers, writers, or both.

Guides 125 guide the tape 122 across the tape head 126. Such tape head126 is in turn coupled to a controller assembly 128 via a cable 130. Thecontroller 128 typically controls head functions such as servofollowing, writing, reading, etc. The controller may operate under logicknown in the art, as well as any logic disclosed herein. The cable 130may include read/write circuits to transmit data to the head 126 to berecorded on the tape 122 and to receive data read by the head 126 fromthe tape 122. An actuator 132 controls position of the head 126 relativeto the tape 122.

An interface 134 may also be provided for communication between the tapedrive and a host (integral or external) to send and receive the data andfor controlling the operation of the tape drive and communicating thestatus of the tape drive to the host, all as will be understood by thoseof skill in the art.

By way of example, FIG. 2 illustrates a side view of a flat-lapped,bi-directional, two-module magnetic tape head 200 which may beimplemented in the context of the present invention. As shown, the headincludes a pair of bases 202, each equipped with a module 204, and fixedat a small angle a with respect to each other. The bases may be“U-beams” that are adhesively coupled together. Each module 204 includesa substrate 204A and a closure 204B with a thin film portion, commonlyreferred to as a “gap” in which the readers and/or writers 206 areformed. In use, a tape 208 is moved over the modules 204 along a media(tape) bearing surface 209 in the manner shown for reading and writingdata on the tape 208 using the readers and writers. The wrap angle θ ofthe tape 208 at edges going onto and exiting the flat media supportsurfaces 209 are usually between about 0.1 degree and about 5 degrees.

The substrates 204A are typically constructed of a wear resistantmaterial, such as a ceramic. The closures 204B made of the same orsimilar ceramic as the substrates 204A.

The readers and writers may be arranged in a piggyback or mergedconfiguration. An illustrative piggybacked configuration comprises a(magnetically inductive) writer transducer on top of (or below) a(magnetically shielded) reader transducer (e.g., a magnetoresistivereader, etc.), wherein the poles of the writer and the shields of thereader are generally separated. An illustrative merged configurationcomprises one reader shield in the same physical layer as one writerpole (hence, “merged”). The readers and writers may also be arranged inan interleaved configuration. Alternatively, each array of channels maybe readers or writers only. Any of these arrays may contain one or moreservo track readers for reading servo data on the medium.

FIG. 2A illustrates the tape bearing surface 209 of one of the modules204 taken from Line 2A of FIG. 2. A representative tape 208 is shown indashed lines. The module 204 is preferably long enough to be able tosupport the tape as the head steps between data bands.

In this example, the tape 208 includes 4 to 22 data bands, e.g., with 16data bands and 17 servo tracks 210, as shown in FIG. 2A on a one-halfinch wide tape 208. The data bands are defined between servo tracks 210.Each data band may include a number of data tracks, for example 512 datatracks (not shown). During read/write operations, the readers and/orwriters 206 are positioned to specific track positions within one of thedata bands. Outer readers, sometimes called servo readers, read theservo tracks 210. The servo signals are in turn used to keep the readersand/or writers 206 aligned with a particular set of tracks during theread/write operations.

FIG. 2B depicts a plurality of readers and/or writers 206 formed in agap 218 on the module 204 in Circle 2B of FIG. 2A. As shown, the arrayof readers and writers 206 includes, for example, 16 writers 214, 16readers 216 and two servo readers 212, though the number of elements mayvary. Illustrative embodiments include 8, 16, 32, 40, and 64 readersand/or writers 206 per array. A preferred embodiment includes 32 readersper array and/or 32 writers per array, where the actual number oftransducing elements could be greater, e.g., 33, 34, etc. This allowsthe tape to travel more slowly, thereby reducing speed-induced trackingand mechanical difficulties and/or execute fewer “wraps” to fill or readthe tape. While the readers and writers may be arranged in a piggybackconfiguration as shown in FIG. 2B, the readers 216 and writers 214 mayalso be arranged in an interleaved configuration. Alternatively, eacharray of readers and/or writers 206 may be readers or writers only, andthe arrays may contain one or more servo readers 212. As noted byconsidering FIGS. 2 and 2A-B together, each module 204 may include acomplementary set of readers and/or writers 206 for such things asbi-directional reading and writing, read-while-write capability,backward compatibility, etc.

FIG. 2C shows a partial tape bearing surface view of complimentarymodules of a magnetic tape head 200 according to one embodiment. In thisembodiment, each module has a plurality of read/write (R/W) pairs in apiggyback configuration formed on a common substrate 204A and anoptional electrically insulative layer 236. The writers, exemplified bythe write head 214 and the readers, exemplified by the read head 216,are aligned parallel to a direction of travel of a tape mediumthereacross to form an R/W pair, exemplified by the R/W pair 222.

Several R/W pairs 222 may be present, such as 8, 16, 32 pairs, etc. TheR/W pairs 222 as shown are linearly aligned in a direction generallyperpendicular to a direction of tape travel thereacross. However, thepairs may also be aligned diagonally, etc. Servo readers 212 arepositioned on the outside of the array of R/W pairs, the function ofwhich is well known.

Generally, the magnetic tape medium moves in either a forward or reversedirection as indicated by arrow 220. The magnetic tape medium and headassembly 200 operate in a transducing relationship in the mannerwell-known in the art. The piggybacked MR head assembly 200 includes twothin-film modules 224 and 226 of generally identical construction.

Modules 224 and 226 are joined together with a space present betweenclosures 204B thereof (partially shown) to form a single physical unitto provide read-while-write capability by activating the writer of theleading module and reader of the trailing module aligned with the writerof the leading module parallel to the direction of tape travel relativethereto. When a module 224, 226 of a piggyback head 200 is constructed,layers are formed in the gap 218 created above an electricallyconductive substrate 204A (partially shown), e.g., of AlTiC, ingenerally the following order for the R/W pairs 222: an insulating layer236, a first shield 232 typically of an iron alloy such as NiFe(permalloy), CZT or Al—Fe—Si (Sendust), a sensor 234 for sensing a datatrack on a magnetic medium, a second shield 238 typically of anickel-iron alloy (e.g., 80/20 Permalloy), first and second writer poletips 228, 230, and a coil (not shown).

The first and second writer poles 228, 230 may be fabricated from highmagnetic moment materials such as 45/55 NiFe. Note that these materialsare provided by way of example only, and other materials may be used.Additional layers such as insulation between the shields and/or poletips and an insulation layer surrounding the sensor may be present.Illustrative materials for the insulation include alumina and otheroxides, insulative polymers, etc.

The configuration of the tape head 126 according to one embodimentincludes multiple modules, preferably three or more. In awrite-read-write (W-R-W) head, outer modules for writing flank one ormore inner modules for reading. Referring to FIG. 3, depicting a W-R-Wconfiguration, the outer modules 402, 406 each include one or morearrays of writers 410. The inner module 404 of FIG. 3 includes one ormore arrays of readers 408 in a similar configuration. Variations of amulti-module head include a R-W-R head (FIG. 4), a R-R-W head, a W-W-Rhead, etc. In yet other variations, one or more of the modules may haveread/write pairs of transducers. Moreover, more than three modules maybe present. In further approaches, two outer modules may flank two ormore inner modules, e.g., in a W-R-R-W, a R-W-W-R arrangement, etc. Forsimplicity, a W-R-W head is used primarily herein to exemplifyembodiments of the present invention. One skilled in the art apprisedwith the teachings herein will appreciate how permutations of thepresent invention would apply to configurations other than a W-R-Wconfiguration.

FIG. 5 illustrates a magnetic head 126 according to one embodiment ofthe present invention that includes first, second and third modules 302,304, 306 each having a tape bearing surface 308, 310, 312 respectively,which may be flat, contoured, etc. Note that while the term “tapebearing surface” appears to imply that the surface facing the tape 315is in physical contact with the tape bearing surface, this is notnecessarily the case. Rather, only a portion of the tape may be incontact with the tape bearing surface, constantly or intermittently,with other portions of the tape riding (or “flying”) above the tapebearing surface on a layer of air, sometimes referred to as an “airbearing”. The first module 302 will be referred to as the “leading”module as it is the first module encountered by the tape in a threemodule design for tape moving in the indicated direction. The thirdmodule 306 will be referred to as the “trailing” module. The trailingmodule follows the middle module and is the last module seen by the tapein a three module design. The leading and trailing modules 302, 306 arereferred to collectively as outer modules. Also note that the outermodules 302, 306 will alternate as leading modules, depending on thedirection of travel of the tape 315.

In one embodiment, the tape bearing surfaces 308, 310, 312 of the first,second and third modules 302, 304, 306 lie on about parallel planes(which is meant to include parallel and nearly parallel planes, e.g.,between parallel and tangential as in FIG. 6), and the tape bearingsurface 310 of the second module 304 is above the tape bearing surfaces308, 312 of the first and third modules 302, 306. As described below,this has the effect of creating the desired wrap angle α₂ of the taperelative to the tape bearing surface 310 of the second module 304.

Where the tape bearing surfaces 308, 310, 312 lie along parallel ornearly parallel yet offset planes, intuitively, the tape should peel offof the tape bearing surface 308 of the leading module 302. However, thevacuum created by the skiving edge 318 of the leading module 302 hasbeen found by experimentation to be sufficient to keep the tape adheredto the tape bearing surface 308 of the leading module 302. The trailingedge 320 of the leading module 302 (the end from which the tape leavesthe leading module 302) is the approximate reference point which definesthe wrap angle α₂ over the tape bearing surface 310 of the second module304. The tape stays in close proximity to the tape bearing surface untilclose to the trailing edge 320 of the leading module 302. Accordingly,read and/or write elements 322 may be located near the trailing edges ofthe outer modules 302, 306. These embodiments are particularly adaptedfor write-read-write applications.

A benefit of this and other embodiments described herein is that,because the outer modules 302, 306 are fixed at a determined offset fromthe second module 304, the inner wrap angle α₂ is fixed when the modules302, 304, 306 are coupled together or are otherwise fixed into a head.The inner wrap angle α₂ is approximately tan⁻¹(δ/W) where δ is theheight difference between the planes of the tape bearing surfaces 308,310 and W is the width between the opposing ends of the tape bearingsurfaces 308, 310. An illustrative inner wrap angle α₂ is in a range ofabout 0.5° to about 1.1°, though can be any angle required by thedesign.

Beneficially, the inner wrap angle α₂ may be set slightly less on theside of the module 304 receiving the tape (leading edge) than the innerwrap angle α₃ on the trailing edge, as the tape 315 rides above thetrailing module 306. This difference is generally beneficial as asmaller α₃ tends to oppose what has heretofore been a steeper exitingeffective wrap angle.

Note that the tape bearing surfaces 308, 312 of the outer modules 302,306 are positioned to achieve a negative wrap angle at the trailing edge320 of the leading module 302. This is generally beneficial in helpingto reduce friction due to contact with the trailing edge 320, providedthat proper consideration is given to the location of the crowbar regionthat forms in the tape where it peels off the head. This negative wrapangle also reduces flutter and scrubbing damage to the elements on theleading module 302. Further, at the trailing module 306, the tape 315flies over the tape bearing surface 312 so there is virtually no wear onthe elements when tape is moving in this direction. Particularly, thetape 315 entrains air and so will not significantly ride on the tapebearing surface 312 of the third module 306 (some contact may occur).This is permissible, because the leading module 302 is writing while thetrailing module 306 is idle.

Writing and reading functions are performed by different modules at anygiven time. In one embodiment, the second module 304 includes aplurality of data and optional servo readers 331 and no writers. Thefirst and third modules 302, 306 include a plurality of writers 322 andno readers, with the exception that the outer modules 302, 306 mayinclude optional servo readers. The servo readers may be used toposition the head during reading and/or writing operations. The servoreader(s) on each module are typically located towards the end of thearray of readers or writers.

By having only readers or side by side writers and servo readers in thegap between the substrate and closure, the gap length can besubstantially reduced. Typical heads have piggybacked readers andwriters, where the writer is formed above each reader. A typical gap is25-35 microns. However, irregularities on the tape may tend to droopinto the gap and create gap erosion. Thus, the smaller the gap is thebetter. The smaller gap enabled herein exhibits fewer wear relatedproblems.

In some embodiments, the second module 304 has a closure, while thefirst and third modules 302, 306 do not have a closure. Where there isno closure, preferably a hard coating is added to the module. Onepreferred coating is diamond-like carbon (DLC).

In the embodiment shown in FIG. 5, the first, second, and third modules302, 304, 306 each have a closure 332, 334, 336, which extends the tapebearing surface of the associated module, thereby effectivelypositioning the read/write elements away from the edge of the tapebearing surface. The closure 332 on the second module 304 can be aceramic closure of a type typically found on tape heads. The closures334, 336 of the first and third modules 302, 306, however, may beshorter than the closure 332 of the second module 304 as measuredparallel to a direction of tape travel over the respective module. Thisenables positioning the modules closer together. One way to produceshorter closures 334, 336 is to lap the standard ceramic closures of thesecond module 304 an additional amount. Another way is to plate ordeposit thin film closures above the elements during thin filmprocessing. For example, a thin film closure of a hard material such asSendust or nickel-iron alloy (e.g., 45/55) can be formed on the module.

With reduced-thickness ceramic or thin film closures 334, 336 or noclosures on the outer modules 302, 306, the write-to-read gap spacingcan be reduced to less than about 1 mm, e.g., about 0.75 mm, or 50% lessthan standard LTO tape head spacing. The open space between the modules302, 304, 306 can still be set to approximately 0.5 to 0.6 mm, which insome embodiments is ideal for stabilizing tape motion over the secondmodule 304.

Depending on tape tension and stiffness, it may be desirable to anglethe tape bearing surfaces of the outer modules relative to the tapebearing surface of the second module. FIG. 6 illustrates an embodimentwhere the modules 302, 304, 306 are in a tangent or nearly tangent(angled) configuration. Particularly, the tape bearing surfaces of theouter modules 302, 306 are about parallel to the tape at the desiredwrap angle α₂ of the second module 304. In other words, the planes ofthe tape bearing surfaces 308, 312 of the outer modules 302, 306 areoriented at about the desired wrap angle α₂ of the tape 315 relative tothe second module 304. The tape will also pop off of the trailing module306 in this embodiment, thereby reducing wear on the elements in thetrailing module 306. These embodiments are particularly useful forwrite-read-write applications. Additional aspects of these embodimentsare similar to those given above.

Typically, the tape wrap angles may be set about midway between theembodiments shown in FIGS. 5 and 6.

FIG. 7 illustrates an embodiment where the modules 302, 304, 306 are inan overwrap configuration. Particularly, the tape bearing surfaces 308,312 of the outer modules 302, 306 are angled slightly more than the tape315 when set at the desired wrap angle α₂ relative to the second module304. In this embodiment, the tape does not pop off of the trailingmodule, allowing it to be used for writing or reading. Accordingly, theleading and middle modules can both perform reading and/or writingfunctions while the trailing module can read any just-written data.Thus, these embodiments are preferred for write-read-write,read-write-read, and write-write-read applications. In the latterembodiments, closures should be wider than the tape canopies forensuring read capability. The wider closures will force a widergap-to-gap separation. Therefore a preferred embodiment has awrite-read-write configuration, which may use shortened closures thatthus allow closer gap-to-gap separation.

Additional aspects of the embodiments shown in FIGS. 6 and 7 are similarto those given above.

A 24 or higher channel version of a multi-module head 126 may use cables350 having leads on the same pitch as current 16 channel piggyback LTOmodules, or alternatively the connections on the module may beorgan-keyboarded for a 50% reduction in cable span. Over-under, writingpair unshielded cables may be used for the writer modules, which mayhave integrated servo readers.

The outer wrap angles α₁ may be set in the drive, such as by guides ofany type known in the art, such as adjustable rollers, slides, etc. Forexample, rollers having an offset axis may be used to set the wrapangles. The offset axis creates an orbital arc of rotation, allowingprecise alignment of the wrap angle α₁.

To assemble any of the embodiments described above, conventional u-beamassembly can be used. Accordingly, the mass of the resultant head can bemaintained or even reduced relative to heads of previous generations. Inother approaches, the modules may be constructed as a unitary body.Those skilled in the art, armed with the present teachings, willappreciate that other known methods of manufacturing such heads may beadapted for use in constructing such heads.

It will be clear that the various features of the foregoingmethodologies may be combined in any way, creating a plurality ofcombinations from the descriptions presented above.

Conventionally, different module designs such as read or write onlymodule formats and a piggyback read/write module formats lack theability to function in more than one product type, e.g., the module fromthe piggyback format cannot be used for the read-only or write-onlyformat and vice versa. Although the transducers used in differentdesigns are potentially identical, module designs have been unsuccessfulthus far in achieving compatibility with more than one product type.Therefore it would be favorable to develop a module design selectivelycompatible with multiple, if not all currently used product types.

Referring to FIG. 8, the module 800 includes an array of N piggyback ormerged first data transducers 802, positioned towards a media facingsurface of the module 800. The first data transducers preferably includeat least one of data readers, data writers, or combinations thereof. Inone approach, the first data transducers 802 may be positioned in a gapbetween the closure 808 and the substrate 810 of the module 800.

The module 800 also includes M second data transducers 804 interleavedwith the array of piggyback or merged first data transducers 802, whereM as used herein is defined as N±P, where P=0, 1, 2, 3, etc. In thiscase, one of the M second data transducers 804 may be located betweeneach of the N piggyback first data transducers 802, and the servoreaders 806 such that each of the N piggyback first data transducers 802has a second data transducer 804 on at least one side. Exemplaryembodiments of various arrays may include 8, 16, 24, 32, 40, 48, 56, 64,etc. first and/or second transducers.

According to different approaches, the second data transducers mayinclude at least one of data readers, data writers, or combinationsthereof. Thus, the second data transducers may be piggybacked, merged,single, etc. data transducers. In a preferred approach, the second datatransducers may be single data transducers. In accordance with thepresent embodiment, “single data transducers” is meant to signify thatthe data transducers are not part of a piggyback or merged datatransducer pair, are not a servo reader, and function only to read orwrite. In one approach, the second data transducers may either be allwriters or all readers depending on the intended function of the module.

The readers and/or writers of the first and second data transducers maybe of identical design (except, of course, for the slight variationsinherent in thin film fabrication). In other approaches, the designs maybe different. Moreover, in a preferred approach, at least some of thefirst and/or second data transducers 802, 804 may be coupled to pads805.

Referring now to FIG. 9, a module 900, according to an exemplaryembodiment, includes a wafer substrate 950, above which is a readtransducer 902 with shields 904, 906. The module 900 additionallyincludes insulation layers 908, 910 to insulate the shields 904, 906from adjacent layers. In a preferred approach, either and/or both of theinsulation layers 908, 910 may be nonmagnetic.

As depicted in FIG. 9, the writer poles 912 and 914 may sandwich thecoils 916; above which may be an overcoat 918 and finally an optionalclosure 920 coupled thereto, e.g., by an adhesive (not shown) of a typeknown in the art.

With continued reference to FIG. 9, the module 900 further includes pads928, 930. According to various approaches, the pads may includeconductive metals e.g., gold, copper, silver, aluminum, etc.; conductiveoxides; etc. Preferably the pads 928, 930 may include materials whichare non-corrosive to prevent and/or minimize degradation of the pads.

The pads may preferably be coupled to one, at least one, some, all, etc.of the transducers of the module, thereby implementing a differentnumber of read and/or write transducers depending on the desiredembodiment.

According to various approaches, different desired embodiments mayinclude a design which implements a different number of read and/orwrite transducers. Thus, exemplary embodiments of various arrays mayinclude 8, 16, 24, 32, 40, 48, 56, 64, etc. first and/or secondtransducers. For example, if the head is to be used for a 32 channelmode and the single data transducers are writers, then the single datatransducers and the writers of piggyback and/or paired data transducersare coupled to the pads, while the readers of the piggyback and/orpaired transducers are not. Thus, a universal array of transducers thatis compatible with multiple formats may be adapted for use with aselected one of the formats by simply coupling the appropriatetransducers to pads during manufacture. More examples will be providedbelow, including illustrative examples of pad coupling schemes (seeFIGS. 11A-11C).

In a preferred approach, the pads may be coupled to the transducers vialeads and/or pad-outs, which may also be implemented in differentcombinations to achieve the desired embodiment. Referring still to FIG.9, transducers may be in electrical communication with the pads 928, 930via leads 924, 922 and 927 and pad-outs 932, 933, 934, 926. According tovarious approaches, various portions of the conductive path may includeconductive layers, conductive vias, secondary leads, cables, etc.Moreover, the pad-outs may include forming conductive vias through thethin film stack as illustrated in FIG. 9. According to differentapproaches, forming the pad-outs may include masking, milling,deposition, plating, etc.

According to various approaches, the leads may be coupled to the pads byany method of coupling which would be apparent to one skilled in the artupon reading the present description. As alluded to above, whenconstructing the wafer, one of the last steps may include padding-outselected leads from their respective levels in the stack, correspondingto the desired functionality of the module. Therefore, not all leadsconnected to transducers may be coupled to pad-outs, depending on thedesired embodiment (explained in further detail below).

Thus, according to various approaches, the pads 928, 930 may be arrangedin a preferred orientation, e.g., a single row, first and second rows,etc., to accommodate the desired embodiment. FIGS. 10A-10F depictdifferent orientations of pads 1002, 1004 in accordance with severalembodiments. As an option, the different orientations of pads 1002, 1004may be implemented in conjunction with features from any otherembodiment listed herein, such as those described with reference to theother FIGS. Of course, however, such orientations of pads 1002, 1004 andothers presented herein may be used in various applications and/or inpermutations which may or may not be specifically described in theillustrative embodiments listed herein. Further, the differentorientations of pads 1002, 1004 presented herein may be used in anydesired environment.

Referring now to FIGS. 10A-10F, pads 1002, 1004 may be arranged invarious orientations according to the desired embodiment. It ispreferred that the distance between coupled pads and transducers be asshort as possible, thereby minimizing noise, time delay, powerconsumption, etc. However, the pads 1002, 1004 may include any pad type,configuration, and/or orientation which is disclosed and/or suggestedherein, or any other pad which would be apparent to one skilled in theart upon reading the present description.

As illustrated in FIG. 10A, the pads 1002, 1004 may be oriented in asingle row, such that the pads 1002 intended for the first datatransducers are positioned on the left while the pads 1004 intended forthe second data transducers are positioned on the right. The oppositeorientation may also be implemented as shown in FIG. 10B where the pads1002 intended for the first data transducers are positioned on the rightwhile the pads 1004 intended for the second data transducers arepositioned on the left. In a preferred approach, the single row of padsis preferably arranged along a single, straight line, but is not limitedthereto. In other approaches, the single row may be slanted, at anangle, varied therealong, etc.

Referring to FIG. 10C, the pads 1002, 1004 may be oriented in a singlerow, such that a group of pads 1002 intended for the first datatransducers are positioned between groups of pads 1004 intended for thesecond data transducers. Again, the opposite orientation may also beimplemented as shown in FIG. 10D where a group of pads 1004 intended forthe second data transducers are positioned between groups of pads 1002intended for the first data transducers.

In yet another approach, the pads 1002, 1004 may be interleaved.

Referring now to FIG. 10E, the pads 1002, 1004 may be oriented in tworows such that the pads 1002 intended for the first data transducers arepositioned above the pads 1004 intended for the second data transducers.Yet again, the opposite orientation may also be implemented as shown inFIG. 10F.

As previously mentioned, in some embodiments, not all transducers arecoupled to pads. According to various approaches, the module having tworows of pads may be configured for a particular format; e.g., the firstrow of pads may be coupled to the data transducers, while the second rowof pads may not be coupled to any of the data transducers; only some ofthe pads in the first row may be coupled to data transducers, while someor all of the pads in the second row are coupled to data transducers; atleast some, a majority, all, etc. of the leads extending from the secondtransducers may be in electrical communication with pads in the firstrow, while at least some, a majority, all, etc. of the leads extendingfrom the second transducers may be in electrical communication with padsin the second row; etc.

In a preferred approach, the pads of each the first and second rows maybe in their own respective single, straight line, but are not limitedthereto. In other approaches, first and second rows may be slanted, atan angle, varied therealong, etc. Moreover, each of the first and secondrows may have similar, the same or different orientation with respect toeach other.

Depending on the desired embodiment, the module may have a set minimumnumber and/or position associated with its transducers and/or pads. Asshown in FIGS. 10A-10E, various orientations are available toaccommodate the desired embodiment of the module. However, in a furtherapproach, a module may include enough transducers and/or pads toaccommodate any desired embodiment.

As alluded to above, leads and/or pad-outs may extend between thetransducers and pads, thereby coupling the transducers and padstogether. Thus, depending on the desired embodiment, the leads and/orpad-outs may be arranged such that different transducers may be coupledto different pads, corresponding to the desired embodiment (see FIGS.11A-11C). For example, a module may have an adequate number oftransducers and pads to form a 8, 16, 32, 40, etc. transducer,interleaved, piggyback, high density write only, etc. module. Therefore,depending on the desired embodiment of a module, the leads and/orpad-outs may connect the appropriate transducers and pads. Moreover,leads extending from the transducers may be coupled to the pads,regardless of the pads' respective orientation.

As alluded to above, when constructing the wafer, one of the last stepsmay include padding-out selected leads from their respective levels inthe stack, corresponding to the desired functionality of the module. Asdepicted in FIG. 9, the module 900 includes leads 922, 924, 927extending from some or each of the first and second data transducers ofboth the first and second data transducer sets. The number and locationof the leads coupled to the pads via the pad-outs, e.g., conductivevias, secondary leads, cables, etc., determines which transducers arefunctional in the module. Thus, if the leads from read transducers ofthe first and second data transducers are coupled to the pads, then themodule may act as a read-only module e.g., having 24, 32 or more readchannels. However, if the leads from the readers and writers of only thefirst transducers are coupled to the leads, then the module functions asa read/write module, e.g., having 16 read channels. See the descriptionof FIGS. 11A-11C below for further embodiments.

Referring again to FIG. 9, leads 922, 924 are coupled to the readtransducer 902. In one approach, the shields 904, 906 may act as theleads 922, 924, e.g., as in a design where the read current travelsperpendicular to the plane of the thin films of the read transducer. Inanother approach, the leads may be in a same plane, e.g., as in a designwhere the read current travels in the plane of the thin films. Leads926, 933 are coupled to the coil 916. Conventional and/or other leaddesigns may be used for any of the transducers, as would be apparent toone skilled in the art upon reading the present disclosure.

It is generally unfavorable for the leads of readers and writers to beinterleaved due to the high possibility of crosstalk. The large amountof current delivered to the writers through the leads to perform a writeoperation may easily be coupled into the reader leads if they aresufficiently close. Even in the case where the readers are not beingused during a write operation, the signal coupling is strong enough tocause leakage back through the reader leads and have even been known todisrupt the controller card functionality. Therefore, it is preferablethat the leads for the writers and readers be separated to differentlevels in the stack on the wafer. With continued reference to FIG. 9,the pad-outs 933, 926, 932, are separated into a first level L₁, asecond level L₂, and a third level L₃ in the stack on the wafer.Moreover, pad-out 934 is shown as not being formed in a level in thestack, but rather is connected directly to pad 930, while pad out 932 iscoupled to a pad behind pad 930. Thus, in one approach pad-outs may notbe separated by levels in the stack on the wafer. In yet anotherapproach, pad-outs may share one or more level.

Accordingly, in one approach, leads extending from the data readers ofthe first data transducers may be present in a first level of thin filmsof the module, and may optionally lie in a common plane, but need not.Additionally, leads extending from the coils of the first datatransducers may be present in one or more levels of thin films of themodule, e.g., in a region above the leads of data readers. Such leadsmay lie in one or more common planes, but need not. According to variousapproaches, the first and second levels, and leads therein, may bearranged in any order vertically and/or horizontally above the wafersubstrate.

Furthermore, leads extending from the second data transducers may bepresent in a third level of thin films of the module. In one approach,the leads extending from the second data transducers may be present inthe first level of thin films of the module if the second datatransducers include data readers. In another approach, the leadsextending from the second data transducers may be present in the secondlevel of thin films of the module if the second data transducers aredata writers. According to various other approaches, the three levelsmay be arranged in any order vertically above the wafer substrate. Infurther approaches, the leads may be partitioned into more than threelevels.

In one approach, only a portion (i.e., less than all) of the leads maybe in electrical communication with the aforementioned pads viapad-outs. In an example according to one approach, only some of theleads may be brought out to the pads, depending on which transducers maybe used for the target application of the module. Moreover, theunconnected leads may simply terminate in the thin film stack of themodule. In various approaches, a module may include some, at least some,all, none, etc. of the transducers coupled to the pads. As describedabove, the way the transducers are coupled to the pads determines whichtransducers are functional in the module.

FIGS. 11A-11C depict representative diagrams for connectors 1102, e.g.,leads and/or pad-outs, connecting transducers and pads, in accordancewith several embodiment. As an option, the present wiring configurationsfor connectors 1102 may be implemented in conjunction with features fromany other embodiment listed herein, such as those described withreference to the other FIGS. Of course, however, such wiringconfigurations for connectors 1102 and others presented herein may beused in various applications and/or in permutations which may or may notbe specifically described in the illustrative embodiments listed herein.Further, the wiring configurations for connectors 1102 presented hereinmay be used in any desired environment. For example, according tovarious approaches, the representative diagrams illustrated in FIGS.11A-11C may incorporate any desired pad layout described and/orsuggested herein, or a pad layout which would be apparent to one skilledin the art upon reading the present description, depending on theembodiment.

As illustrated in the interleaved representative diagram of FIG. 11A,the readers 1106 from the piggyback or merged first data transducers andthe second data transducers 1110, e.g., writers, are connected to theirrespective pads 1104 via the connectors 1102.

Referring to FIG. 11B, the piggyback representative diagram nowillustrates the readers 1106 and writers 1108 from the piggyback ormerged first data transducers are connected to their respective pads1104 via the connectors 1102, while the second data transducers 1110 arenot coupled to pads.

Referring now to FIG. 11C, the representative diagram illustrates a highdensity write only module in which the writers 1108 from the N piggybackor merged first data transducers and M second data transducers 1110,e.g., writers, are connected to their respective pads 1104 via theconnectors 1102.

In one embodiment, all of the transducers on the module may be connectedto their respective leads; however, not all leads are coupled to thepads. Therefore, although all the transducers may be connected to theirrespective leads, only selected leads may be connected to pads.

Furthermore, a cable may provide at least a portion of conductive pathbetween a magnetic head and the controller according to any approachdescribed and/or suggested herein. In an exemplary approach, all of thetransducers on the module may be connected to their respective pads.Thus, although all of the transducers on the module may be connected totheir respective pads, the cable may be coupled to only some of thepads, thereby ultimately determining which transducers are functional inthe module. In another approach, not all transducers are coupled topads, but the cable is coupled to all of the pads.

In one approach, a cable may connect at least some of the pads from amodule to a multiplexer, which in turn couples the cable to thecontroller. Moreover, the multiplexer may be connected to the controllervia a bus, cable, wire, wireless signal, etc.

According to one embodiment, a data storage system may include amagnetic head. In one approach, the magnetic head may include 1, atleast 2, at least 3, at least 4, etc. modules according to any of theembodiments described and/or suggested herein. According to variousapproaches, the modules included in the data storage system may besimilar, the same or different from each other.

The data storage system may also include a drive mechanism for passing amagnetic medium over the magnetic head.

The data storage system may further include a controller electricallycoupled to the magnetic head. In various approaches, the controller maybe electrically coupled via leads, a cable, wirelessly, etc.

The embodiments described and/or suggested herein illustrate moduledesigns compatible with 32 channel products, 16 channel products, etc.These design features may preferably allow all modules to be reusableamong different, more preferably all products as described above. Suchability effectively reduces management, complexity, etc. by reducinginventory, wafer processing, etc.

While various embodiments have been described above, it should beunderstood that they have been presented by way of example only, and notlimitation. Thus, the breadth and scope of an embodiment of the presentinvention should not be limited by any of the above-described exemplaryembodiments, but should be defined only in accordance with the followingclaims and their equivalents.

What is claimed is:
 1. An apparatus, comprising: a magnetic head having,on one module thereof, an array of N first data transducers positionedtowards a media facing surface of the module and M second datatransducers interleaved with the array of first transducers, whereinonly some of the data transducers are coupled to pads.
 2. The apparatusas recited in claim 1, wherein all of the first and/or second datatransducers are coupled to the pads.
 3. The apparatus as recited inclaim 1, wherein less than all of the first and/or second datatransducers are coupled to the pads.
 4. The apparatus as recited inclaim 3, wherein the pads are present in a single row.
 5. The apparatusas recited in claim 3, comprising leads extended from each of the firstand second data transducers, wherein only a portion of the leads are inelectrical communication with the pads.
 6. The apparatus as recited inclaim 5, further comprising a plurality of second pads, wherein thesecond pads are not coupled to any of the data transducers.
 7. Theapparatus as recited in claim 1, wherein the pads are arranged in asingle row, and further comprising leads extending from each of thefirst and second data transducers, wherein leads extending from datareaders of the first data transducers are present in a first level ofthin films of the module, wherein leads extending from data writers ofthe first data transducers are present in a second level of thin filmsof the module, wherein leads extending from the second data transducersare present in a third level of thin films of the module, wherein leadsfrom only two of the levels are coupled to the pads.
 8. The apparatus asrecited in claim 1, wherein the pads are arranged in first and secondrows, and further comprising leads extending from each of the first andsecond data transducers, wherein the leads extending from the first datatransducers are in electrical communication with the pads in the firstrow, wherein the leads extending from the second transducers are inelectrical communication with the pads in the second row, wherein atleast some of the leads extending from the second transducers are alsoin electrical communication with pads in the first row.
 9. The apparatusas recited in claim 1, wherein the first data transducers are piggybackdata transducers.
 10. The apparatus as recited in claim 9, wherein thesecond data transducers are single data transducers.
 11. The apparatusas recited in claim 9, wherein the second data transducers are singledata transducers.
 12. The apparatus as recited in claim 1, wherein thefirst data transducers are merged data transducers.
 13. The apparatus asrecited in claim 12, wherein the second data transducers are single datatransducers.
 14. The apparatus as recited in claim 1, wherein the headhas, on a second module thereof, an array of N third data transducerspositioned towards a media facing surface of the second module and Mfourth data transducers interleaved with the array of third datatransducers, wherein at least some of the data transducers are coupledto pads on the second module.
 15. The apparatus as recited in claim 1,comprising: a drive mechanism for passing a magnetic medium over themagnetic head; a controller electrically coupled to the magnetic head;and a cable providing at least a portion of a conductive path betweenthe magnetic head and the controller, wherein all transducers arecoupled to pads, wherein the cable is coupled to only some of the pads.16. The apparatus as recited in claim 1, comprising: a drive mechanismfor passing a magnetic medium over the magnetic head; a controllerelectrically coupled to the magnetic head; and a cable providing atleast a portion of a conductive path between the magnetic head and thecontroller, wherein not all transducers are coupled to pads, wherein thecable is coupled to all of the pads.
 17. An apparatus, comprising: amagnetic head having, on one module thereof, an array of datatransducers positioned towards a media facing surface of the module, thedata transducers including at least one of data readers, data writers,and combinations thereof; a plurality of pads on the module; and whereinless than all of the data transducers are coupled to pads.
 18. Theapparatus as recited in claim 17, wherein the data transducers aresingle data transducers.
 19. The apparatus as recited in claim 17,wherein the pads are present in a single row.
 20. The apparatus asrecited in claim 19, comprising leads extended from each of the datatransducers, wherein only a portion of the leads are in electricalcommunication with the pads.